300mm Process Carrier (FOUP)

• For processing 300mm wafers
• ePAK eFOUP – Front Opening Unified Pod
• 25 wafer capacity
• SEMI Standard Compliant
• Infopad for FEOL/BEOL identification
• Low outgassing materials protect wafers
• Optional purge or diffuser ports
• Overall size: 420mm x 342mm x 338mm

Meet the team.

STEVE AMBUUL

CHIEF OF STAFF

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